Infrastructure Focus
Exposure to companies supporting the physical systems behind next-generation AI chips.
AI compute infrastructure • Advanced packaging • Backend bottlenecks
The $STACK Index
Owning the semiconductor bottleneck. Traditional semiconductor exposure is crowded. STACK targets the physical layer AI chips depend on: advanced packaging, assembly, test, inspection, metrology, high-purity systems, interconnects, cooling, and deployment infrastructure.
20-Ticker Model
ETF-Ready Framework
Institutional Documentation
Investment Thesis
Built around the infrastructure layer powering AI compute.
Bottleneck Exposure
Advanced packaging, testing, yield control, thermal validation, power and high-purity systems.
Differentiated Portfolio
Designed to isolate backend and infrastructure exposure rather than broad semiconductor beta.
20Target Constituents
4Portfolio Tiers
20Final Constituents
Architecture
AI compute is a physical supply chain.
STACK is designed around the companies required to manufacture, package, test, connect, cool, and deploy AI compute capacity.
Chip Design
Wafer Fabrication
Advanced Packaging
Assembly & Test
Inspection, Metrology & Yield Control
Power, Cooling & Data Center Deployment
De-Risking Map
From concept to launch-ready infrastructure.
Methodology100%
Governance Framework100%
Data Room100%
ETF Platform ReviewActive
Seed CapitalIn Progress
Roadmap
STACK launch progression.
Phase 1
Research & Architecture
Physical bottleneck thesis, universe definition, and category design.
Phase 2
Methodology
Constituent framework, tier structure, liquidity controls, and maintenance logic.
Phase 3
Governance
Governance charter, review controls, corporate actions, and operating policies.
Phase 4
Data Room
Executive summary, implementation materials, source evidence, simulations, and registers.
Phase 5
Sponsor & Capital Preparation
Current phase: sponsor onboarding, advisory development, investor outreach, and launch funding preparation.
Phase 6
ETF Launch
Upcoming: New Fund Committee review, platform agreement, registration process, market-maker coordination, and launch execution.
Project Update
Current status: sponsor onboarding and platform review.
STACK has completed its core methodology and governance framework. The current focus is final-portfolio synchronization, sponsor onboarding, advisory-board development, launch funding, and ETF platform execution.
Why STACK
STACK vs Traditional Semiconductor ETFs
STACK
Targets semiconductor infrastructure, advanced packaging, testing, metrology, cooling, deployment and backend bottlenecks.
SMH
Broad semiconductor exposure with significant concentration in large chip leaders.
SOXX
Broad semiconductor exposure across designers, manufacturers and equipment providers.
Investor FAQ
Frequently Asked Questions
Why Infrastructure?
AI demand ultimately depends on physical capacity, packaging, testing, power and deployment.
Why 20 Holdings?
Concentrated exposure to the highest-conviction infrastructure companies.
Current Status?
Core documentation is complete. Final-portfolio synchronization, sponsor onboarding, launch funding, and platform execution are the current priorities.
Founder
Built from Industry Experience
STACK was developed from a semiconductor infrastructure perspective focused on the physical bottlenecks required to scale AI compute capacity.
De‑Risking Progress
Institutional readiness and ETF launch preparation.
Methodology
Complete
Governance
Complete
Data Room
Complete
Watchlist
Complete
Historical Simulation
Refresh required for final portfolio
Website & Investor Portal
Live
Investor Materials
Complete and gated by inquiry review
Legal Entity
Formed
ETF Platform Engagement
Active
Current Portfolio
Final 20-constituent STACK portfolio.
The portfolio below reflects the controlling Final Portfolio Schedule v1.0. Target weights total 100.00% across four strategic tiers.
33.00%Tier 1
22.00%Tier 2
29.40%Tier 3
15.60%Tier 4
| Tier | Ticker | Company | Target Weight |
|---|---|---|---|
| Tier 1 — Anchors | AMAT | Applied Materials | 16.50% |
| Tier 1 — Anchors | KLAC | KLA Corporation | 16.50% |
| Tier 2 — Core | CRDO | Credo Technology Group | 4.40% |
| Tier 2 — Core | 4062.T | Ibiden Co., Ltd. | 4.40% |
| Tier 2 — Core | 6488.TWO | GlobalWafers Co., Ltd. | 4.40% |
| Tier 2 — Core | 3436.T | SUMCO Corporation | 4.40% |
| Tier 2 — Core | ASX | ASE Technology Holding | 4.40% |
| Tier 3 — Specialized Infrastructure | AMKR | Amkor Technology | 4.20% |
| Tier 3 — Specialized Infrastructure | TER | Teradyne | 4.20% |
| Tier 3 — Specialized Infrastructure | ENTG | Entegris | 4.20% |
| Tier 3 — Specialized Infrastructure | 6857.T | Advantest | 4.20% |
| Tier 3 — Specialized Infrastructure | 6146.T | DISCO Corporation | 4.20% |
| Tier 3 — Specialized Infrastructure | UCTT | Ultra Clean Holdings | 4.20% |
| Tier 3 — Specialized Infrastructure | VRT | Vertiv Holdings | 4.20% |
| Tier 4 — Specialists | 4063.T | Shin-Etsu Chemical | 2.60% |
| Tier 4 — Specialists | 6407.T | CKD Corporation | 2.60% |
| Tier 4 — Specialists | 4004.T | Resonac Holdings | 2.60% |
| Tier 4 — Specialists | APH | Amphenol | 2.60% |
| Tier 4 — Specialists | 2449.TW | King Yuan Electronics | 2.60% |
| Tier 4 — Specialists | ETN | Eaton Corporation | 2.60% |
Target portfolio for discussion purposes only. Foreign-market display tickers and calculation-agent identifiers remain subject to service-provider verification. This is not an offer to buy or sell securities.
Investor Relations
Request materials or contact STACK.
Investor inquiries: investors@stackinfrastructureholdings.com
Confidential discussion materials only. Not investment advice, not legal advice, not a prospectus, not a solicitation, and not official ETF performance material.