Infrastructure Focus
Exposure to companies supporting the physical systems behind next-generation AI chips.
AI compute infrastructure • Advanced packaging • Backend bottlenecks
Owning the semiconductor bottleneck. Traditional semiconductor exposure is crowded. STACK targets the physical layer AI chips depend on: advanced packaging, assembly, test, inspection, metrology, high-purity systems, interconnects, cooling, and deployment infrastructure.
Investment Thesis
Exposure to companies supporting the physical systems behind next-generation AI chips.
Advanced packaging, testing, yield control, thermal validation, power and high-purity systems.
Designed to isolate backend and infrastructure exposure rather than broad semiconductor beta.
Architecture
STACK is designed around the companies required to manufacture, package, test, connect, cool, and deploy AI compute capacity.
De-Risking Map
Roadmap
Physical bottleneck thesis, universe definition, and category design.
Constituent framework, tier structure, liquidity controls, and maintenance logic.
Governance charter, review controls, corporate actions, and operating policies.
Executive summary, implementation materials, source evidence, simulations, and registers.
Current phase: investor outreach, partner conversations, and launch-readiness positioning.
Upcoming: final service-provider onboarding and launch execution.
Project Update
STACK has completed the core documentation stack, including methodology, governance, maintenance, liquidity, watchlist, simulation, and data room materials. The current focus is seed capital, investor outreach, and ETF launch preparation.
Investor Relations
Investor inquiries: investors@stackinfrastructureholdings.com
Confidential discussion materials only. Not investment advice, not legal advice, not a prospectus, not a solicitation, and not official ETF performance material.